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首页> 外文期刊>Chemistry Letters >Enhancement of Thermal Stability (T-g = 260 degrees C) of Ether-bridged Fluorinated Poly(phenylquinoxaline)s with Excellent Dielectric Properties and Water Repellent Characteristics
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Enhancement of Thermal Stability (T-g = 260 degrees C) of Ether-bridged Fluorinated Poly(phenylquinoxaline)s with Excellent Dielectric Properties and Water Repellent Characteristics

机译:具有优异的介电性能和憎水特性的醚桥氟化聚苯喹喔啉酯的热稳定性(T-g> = 260摄氏度)的增强

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摘要

Novel ether-bridged fluorinated poly(phenylquinoxaline) (PEPPQ) dielectric films with enhanced glass-transition temperatures (T-g) have been developed in order to meet the high temperature demands for interlayer dielectrics used in microelectronic fabrication. The PEPPQ films were prepared from newly-developed aromatic bis(alpha-diketone) monomers containing ortho-substituted methyl groups (2-1) or a fluorene moiety (2-2) in their molecular structures. The obtained PEPPQ films exhibited excellent combined properties, including high thermal stability with T-g over 260 degrees C, high electrical insulating characteristics with a volume resistivity of over 10(17) Omega cm, and a dielectric strength higher than 212 V mu m(-1). Besides, the bulky substituents and low-molar-electronegative trifluoromethyl groups endowed the polymers with low dielectric constants (D-K < 2.82 at 1 MHz) and good water repellent property.
机译:为了满足对微电子制造中使用的层间电介质的高温需求,已经开发了具有增强的玻璃化转变温度(T-g)的新型醚桥氟化聚(苯基喹喔啉)(PEPPQ)电介质膜。 PEPPQ薄膜由新开发的在分子结构中包含邻位取代的甲基(2-1)或芴部分(2-2)的芳香族双(α-二酮)单体制备。所得的PEPPQ薄膜具有优异的综合性能,包括260摄氏度以上的Tg具有高的热稳定性,高电绝缘特性,体电阻率超过10(17)Ω·cm和介电强度高于212 Vμm(-1) )。此外,庞大的取代基和低摩尔电负性三氟甲基赋予聚合物低介电常数(在1 MHz下D-K <2.82)和良好的拒水性能。

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