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首页> 外文期刊>電子情報通信学会技術研究報告. 環境電磁工学. Electromagnetic Compatibility >Impedance analysis on power distribution lines in multi-layer printed wiring board
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Impedance analysis on power distribution lines in multi-layer printed wiring board

机译:多层印刷线路板中配电线的阻抗分析

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摘要

To research the relationship between a board resonance and an effect of an additional inductance to the power lines in a module on PWB, we constructed a real-board and made measurements of its radiated emissions. In addition, impedance for elements of the board was measured and is related to its emissions. As a conclusion, for a board with a power-plane structure, the method of an additional inductance is much influenced by the effect of a loop resonance which includes a path through a decoupling capacitor. Each impedance of elements in a board can be a characteristic to evaluate the effect of an additional inductance.
机译:为了研究电路板谐振与PWB上模块中电源线的附加电感影响之间的关系,我们构建了一块真实电路板并对其辐射发射进行了测量。此外,还测量了电路板元件的阻抗,并与辐射有关。结论是,对于具有电源平面结构的电路板,附加电感的方法受环路谐振影响的影响很大,环路谐振包括通过去耦电容器的路径。板上元件的每个阻抗可以是评估附加电感影响的特性。

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