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Delay Analysis of Sub-Path on Fabricated Chips by Several Path-delay Tests

机译:通过几种路径延迟测试来分析制造芯片上子路径的延迟

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摘要

We propose a method to analysis the delay of the sub-path on fabricated chips by the several path-delay tests. In recent years, the process variation causes the timing faults. To detect the faults, the path-delay test is one of the most promising methods. The path-delay test checks whether the signals along the target paths in fabricated LSIs are propagated under the specified frequency. In this paper, we propose a method to analysis the delay value of the paths with path-delay tests. The proposed method consists of 1) path-delay tests for several paths, 2) estimation of the sub-path of the testing paths, and 3) expansion of the remaining path according to the resultant estimations. We confirm that our proposed method calculates the delay with about 0.05% errors empirically.
机译:我们提出了一种通过几种路径延迟测试来分析制造芯片上子路径延迟的方法。近年来,过程变化导致定时故障。为了检测故障,路径延迟测试是最有前途的方法之一。路径延迟测试检查在制造的LSI中沿目标路径的信号是否以指定的频率传播。在本文中,我们提出了一种使用路径延迟测试来分析路径延迟值的方法。所提出的方法包括:1)对多个路径的路径延迟测试; 2)对测试路径的子路径的估计;以及3)根据所得估计来扩展剩余路径。我们确认,我们提出的方法凭经验计算出的延迟约为0.05%。

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