Study of Ni/Cu Plating for High-Efficiency Crystalline Silicon Solar Cells

摘要

The fabrication processes of high-efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/Ag contact, however, this contact formation processed by expensive materials. With alternative solution of like this demerit is low-cost nickel-copper metal contact has been formed by using a low-cost electroless and electroplating. Nickel-copper alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution. So, crystalline silicon solar cells of nickel-copper contact by plating are low-cost and high-efficiency. In this paper, we investigated low-cost nickel-copper contact formation of high-efficiency crystalline silicon solar cells by electroless and electroplating.