As the feature of materials in the scale of sub-micrometer to nanometers, the mechanical properties of nanostructure materials are different from their bulk structures. The understanding of relationship between nanostructure and mechanical properties is a common challenge to semiconductor, MEMS and nanotechnologies. This article presents one of the direct non- destructive and less ambiguous experimental uniaxial stress testing techniques for the mechanical characterization of freestanding thin films using specimens with dimensions as few hundred nanometers. This testing approach was proved to yield the direct experimental mechanical property values. These data can then be used to construct an accurate stress models for the mechanical behavior of thin film materials use for semiconductor, MEMS and nanotechnologies.
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