Analysis of millimeter-wave packaging structure using electromagnetic simulator and its application to W-band package

摘要

A low cost ceramic packaging structure with flip-chip interconnects has been developed using a 3D-electromagnetic simulator for millimeter-wave applications. An improved coplanar waveguide and a feedthru structure are proposed to reduce radiation loss and to satisfy mass production design rule for multi-layer ceramic technology. A ceramic package with the developed structure was fabricated for MMICs up to W-band. The measured 76GHz amplifier MMIC flipped on the package showed a good performance.