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Designation of Wire Wound Type Chip Inductor using FEM Analysis of Electro-magnetic Field

机译:基于电磁场有限元分析的绕线型贴片电感的设计

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The dependency of Q-factor on the construction of Wire Wound Type Chip Inductor has been investigated by FEM analysis (ANSYS. Inc.).Calculated magnetic flux distribution shows that the leakage of magnetic flux at the edges of ferrite core and the ends of coil increases with increasing in permeability of ferrite core.The penetration of leakage flux into metal frames raises the resistance of the inductor through eddy current loss, and deteriorates the Q-factor.By distancing the metal frame 500 #mu#m away from the surface of ferrite core, the leakage flux intersecting the metal frame is reduced to a quarter of that an close contact and the Q-factor is enhanced to 50. When the metal frame is in close contact, the leakage flux and Q-factor are 0.45 X 10~(-4)(T) 30, respectively.
机译:通过有限元分析(ANSYS.Inc。)研究了Q因子对绕线型片状电感器构造的依赖性。计算的磁通量分布表明,在铁氧体磁心的边缘和线圈端部的磁通泄漏随着铁氧体磁心磁导率的增加,漏磁通量渗透到金属框架中,从而通过涡流损耗而增加了电感的电阻,并恶化了Q因子。通过使金属框架远离金属表面500#μ#m铁氧体磁心,与金属框架相交的漏磁通减少到紧密接触的四分之一,并且Q因子提高到50。当金属框架紧密接触时,漏磁通和Q因子为0.45 X 10 〜(-4)(T)30。

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