An interconnection structure on multi-layered substrates with impedance transforming

摘要

This report proposes a interconnection structure on multi-layered substrates with impedance transforming. The impedance transformer of low-pass filter form is realized with inductance of via-holes and parasitic capacitance of land conductors around the via-holes. There are good agreements in calculated performances of the interconnection structure between the equivalent circuit and the electromagnetic simulations.