A study on improvement of electromagnetic environment in package at 76GHz band, using wave absorber

摘要

It is pointed out that source of noise influence on electronic parts by the electromagnetic coupling and the resonance phenomenon in the package, because an integratied circuit in the package can be a source of noise. It will be considered that the wave absorber is attached in the package for the noise countermeasure. To the authors' knowledge, however, there are few studies on the effect of absorption under the conventional wave absorber is attached in the package. Because inside of package is considered to be near fields. In this study, the absorption effect was measured in the model for 76GHz band, on condition that the wave absorber was attached in the package. The measured result was compared with the calculated result by FDTD method. As a result, it is confirmed that the good performances are obtained by the attachment of wave absorber in the package, on condition that the thickness of wave absorber is more than 30% conventional one.