The Fundamental Principles and Techniques of X-Ray Stress Measurement and Current Developments in the Field 2.Microstress and Macrostress

Keisuke Tanaka; Yoshiaki Akiniwa

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The Fundamental Principles and Techniques of X-Ray Stress Measurement and Current Developments in the Field 2.Microstress and Macrostress

机译：X射线应力测量的基本原理和技术以及该领域的最新进展2.微应力和大应力

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来源
《材料》 |1998年第12期|共7页
作者
Keisuke Tanaka; Yoshiaki Akiniwa;
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原文格式 PDF
正文语种 jpn
中图分类工程材料学;
关键词
x-ray stress measurement; macrostress; residual stress; composite materials; X射线分析; 残余应力; 微观; 宏观;

机译：x-ray stress measurement;macrostress;residual stress;composite materials;X射线分析;残余应力;微观;宏观;

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1. The Fundamental Principles and Techniques of X-Ray Stress Measurement and Current Developments in the Field 2.Microstress and Macrostress [J] . Keisuke Tanaka, Yoshiaki Akiniwa 材料 . 1998,第12期

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2. The fundamental principles and techniques of X-ray stress measurement and current developments in the field [J] . Takao Hanabusa 材料 . 1999,第1期

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机译：X射线应力测量的基本原理和技术以及该领域的最新发展
4. The Development of Alternating Current Field Measurement (ACFM) Technology as a Technique for the Detection of Surface Breaking Defects in Conducting Materials and its Use in Commercial and Industrial Applications [C] . Alan Raine 15th world conference on non-destructive testing . 2000

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5. X-RAY DIFFRACTION MEASUREMENT OF RESIDUAL STRESS (STRAIN): ENERGY DISPERSIVE X-RAY RESIDUAL STRESS MEASUREMENT. [D] . ROSEMEIER, RONALD GEORGE. 1981

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6. Operative Surgery-Fundamental International Techniques: General Principles Breast and Hernia (Third Edition) [O] . Mark M. Ravitch 1980

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7. The Fundamental Principles and Techniques of X-Ray Stress Measurement and Current Developments in the Field. III: Surface Stress and Textured Materials. [O] . Takao HANABUSA 1999

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8. Radiation Dosimetry of Computed Tomography X-Ray Scanners. Principles and Techniques of Measurement [R] . Poletti, J. L., Williamson, B. D. P., Le Heron, J. C. 1983

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The Fundamental Principles and Techniques of X-Ray Stress Measurement and Current Developments in the Field 2.Microstress and Macrostress

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