An Engineering Method to Estimate the Junction Temperatures of Light-Emitting Diodes in Multiple LED Application

摘要

Acquiring the junction temperature of light emitting diode (LED) is essential for performance evaluation. But it is hard to get in the multipleLED applications. In this paper, an engineering method is presented to estimate the junction temperatures of LEDs in multiple LED applications. This method is mainly based on an analytical model, and it can be easily applied with some simple measurements. Simulations and experiments were conducted to prove the feasibility of the method, and the deviations among the results obtained by the present method with those by simulation as well as experiments are less than 2% and 3%, respectively. In the final part of this study, the engineering method was used to analyze the thermal resistances of a street lamp. The material of leadframe was found to affect the system thermal resistance mostly, and the choice of solder material strongly depended on the material of the leadframe.