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Calcium aluminate cement tapes - Part II: Physical properties

机译:铝酸钙水泥带-第二部分:物理性能

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摘要

Tape casting is a process often used for the preparation of microelectronics substrates. The present work is a continuation of the first part where we have discussed the structural and microstructural characteristics of calcium aluminate cement tape. Indeed, in this second part, we focus on the physical properties of these tapes such as electrical, thermal, mechanical characterizations and surface roughness. We studied in particular how these physical properties vary according to the setting environment (water, air at 50% relative humidity or air saturated in humidity), setting time (1 day, 4 days or 1 month) and setting temperature (20 ℃ or 70 ℃ in the case of water setting environment). A Heat treatment on the consolidated tape was made essentially to decrease the dielectric constant. Following our results and comparing the physical properties with those of substrates commonly used in microelectronics, in particular alumina substrates, our films can be potentially used as microelectronics substrate.
机译:胶带浇铸是通常用于制备微电子衬底的过程。目前的工作是第一部分的继续,我们已经讨论了铝酸钙水泥带的结构和微观结构特征。确实,在第二部分中,我们重点介绍了这些胶带的物理特性,例如电学,热学,机械特性和表面粗糙度。我们特别研究了这些物理特性如何根据设置环境(水,相对湿度为50%的空气或湿度饱和的空气),设置时间(1天,4天或1个月)和设置温度(20℃或70)而变化℃(遇水凝固的环境)。在固结带上进行热处理以实质上降低介电常数。根据我们的结果,并将其物理性质与微电子学中常用的基材(特别是氧化铝基材)进行比较,我们的膜可以潜在地用作微电子学基材。

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