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首页> 外文期刊>Journal of the European Ceramic Society >Densification of SiC by SPS-effects of time, temperature and pressure
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Densification of SiC by SPS-effects of time, temperature and pressure

机译:SPS在时间,温度和压力的影响下致密化SiC

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摘要

Temperature, holding time and conditions of pressure application, three of the most important spark plasma sintering (SPS) parameters, have been reviewed to assess their effect on the densification and grain growth kinetics of a pure commercially available submicrometer-sized silicon carbide powder. Experiments were performed in the 1750-1850 deg C temperature range with holding time from 1 to l0min. Two pressure setups were used: one with pressure (75 MPa) applied at 1000 deg C and the other with ultimate pressure applied at sintering temperature. Experimental data highlighted the fact that temperature and holding time have a different impact on grain growth and densification. Diffusion and migration mechanisms that promote grain growth were found to be strongly dependent on temperature, the latter being linked to pulsed current intensity. Conditions of pressure application suggest that the ultimate pressure applied at higher temperature increases densification by keeping small surface contact between particles.
机译:审查了温度,保持时间和施压条件,这是最重要的三个火花等离子体烧结(SPS)参数,以评估它们对纯市售亚微米级碳化硅粉末的致密化和晶粒生长动力学的影响。实验是在1750-1850摄氏度的温度范围内进行的,保持时间为1到10分钟。使用两种压力设置:一种在1000摄氏度下施加压力(75 MPa),另一种在烧结温度下施加极限压力。实验数据强调了这样一个事实,温度和保温时间对晶粒的生长和致密化有不同的影响。发现促进晶粒生长的扩散和迁移机制强烈依赖于温度,后者与脉冲电流强度有关。施加压力的条件表明,在较高温度下施加的最终压力通过保持颗粒之间的较小表面接触而增加了致密化。

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