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首页> 外文期刊>Journal of solid state electrochemistry >Mn-Co spinel protective-conductive coating on AL453 ferritic stainless steel for IT-SOFC interconnect applications
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Mn-Co spinel protective-conductive coating on AL453 ferritic stainless steel for IT-SOFC interconnect applications

机译:用于IT-SOFC互连应用的AL453铁素体不锈钢上的Mn-Co尖晶石保护性导电涂层

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摘要

This paper presents research on the synthesis and properties of the Mn _(1.5)Co_(1.5)O_4 (MC) spinel powder, as well as its application for the preparation of a MC thick film on the AL453 steel to be used for metallic interconnect material in IT-SOFCs. In order to prepare the MC micropowder with excellent homogeneity of the chemical and phase compositions, EDTA gel processes were utilized. In order to improve the contact electrical resistance between an AL453 steel interconnect and the La_(0.8)Sr _(0.2)FeO_3 (LSF) cathode and protect the cathode from Cr poisoning, the surface of the AL453 steel was coated with a protective manganese cobaltite spinel matrix using screen printing in combination with an appropriate heat treatment. The oxidation of the AL453/MC composite layer carried out in the air-H_2O gas mixture at 1,073 K for 55 h showed that the spinel coating may serve as an effective barrier against outward Cr diffusion from the AL453 steel and, therefore, significantly inhibit the formation of volatile Cr vapors from the chromia scale. The contact ASR study of the interconnect-cathode interface in the AL453/MC/LSCM/LSF/LSCM/MC/AL453 system carried out in the range of 723-1,073 K in air showed a very large drop in ASR compared to the resistance of the AL453/LSCM/LSF/LSCM/AL453 system without the spinel coating.
机译:本文介绍了Mn _(1.5)Co_(1.5)O_4(MC)尖晶石粉的合成和性能研究及其在AL453钢上制备MC厚膜以用于金属互连的应用IT-SOFC中的材料。为了制备具有优异化学和相组成均一性的MC微粉,使用了EDTA凝胶工艺。为了提高AL453钢互连线与La_(0.8)Sr_(0.2)FeO_3(LSF)阴极之间的接触电阻并保护阴极免受Cr中毒,AL453钢的表面涂有保护性锰钴矿尖晶石基体采用丝网印刷结合适当的热处理。在空气-H_2O气体混合物中以1,073 K进行的AL453 / MC复合层的氧化持续55 h,表明尖晶石涂层可作为有效的阻挡层阻止Cr从AL453钢向外扩散,因此显着抑制了由氧化铬形成挥发性的Cr蒸气。在空气中723-1,073 K的范围内对AL453 / MC / LSCM / LSF / LSCM / MC / AL453系统中的互连阴极接口进行接触式ASR研究表明,与电阻相比,ASR的下降幅度非常大。没有尖晶石涂层的AL453 / LSCM / LSF / LSCM / AL453系统。

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