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Simulation of Pharmaceutical Blister Pack Thermoforming using a Non-isothermal Integral Model

机译:使用非等温积分模型模拟药物泡罩包装热成型

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potential material change for a pharmaceutical blister pack required costly and time-consuming re-validaton. One of the major issues associated with this is the water vapour barrier of a formed blister needed to guarantee an acceptable shelf life of the packaged drugs. This study considered a non-isothermal FEM analysis of the forming process, using the new model incorporated into the POLYFLOW simulation software, and taking into account plug assist forming. This was validated on current materials before being used for the new material. A new post processor was used to calculate the moisture barrier of each blister, and to evaluate he potential benefit of using a new material for medical packaging.
机译:药品泡罩包装的潜在材料更改需要昂贵且耗时的重新验证。与此相关的主要问题之一是为确保包装药物具有可接受的保质期所需的成型泡罩的水蒸气阻隔性。这项研究考虑了成型过程的非等温有限元分析,它使用并入POLYFLOW仿真软件的新模型,并考虑了插塞辅助成型。在用于新材料之前,已在当前材料上对此进行了验证。使用新的后处理器来计算每个泡罩的防潮层,并评估将新材料用于医疗包装的潜在好处。

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