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Molecular dynamics studies of the sputtering of divertor materials

机译:偏滤器材料溅射的分子动力学研究

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We use molecular dynamics (MD) simulations to study two important erosion processes of divertor materials, namely the chemical sputtering of carbon by hyperthermal deuterium and the self-sputtering of W by redeposited atoms. Although it is generally accepted that MD simulations can provide a good qualitative description of far-from-equilibrium processes, such as irradiation-induced cascades, we show that also good quantitative agreement with experiments is obtained. We further show that the chemical sputtering yield of carbon is reduced by Si doping at impact energies less than or equal to 20 eV. Significant carbon sputtering is still observed for both undoped and doped structures at 5 eV. Silicon sputtering is negligible at all impact energies studied. For W self-sputtering, sputtering yields higher than one are observed at greater than or equal to 1 keV for normal incidence and at greater than or equal to 500 eV for 20degrees off-normal incidence. (C) 2003 Elsevier Science B.V. All rights reserved. [References: 34]
机译:我们使用分子动力学(MD)模拟来研究偏滤器材料的两个重要腐蚀过程,即高温氘对碳的化学溅射和再沉积原子对W的自溅射。尽管人们普遍认为MD模拟可以提供很好的定性描述,例如辐射诱导的级联等远离平衡的过程,但我们证明与实验也取得了良好的定量一致性。我们进一步表明,在小于或等于20 eV的冲击能量下,Si掺杂会降低碳的化学溅射产量。对于未掺杂和掺杂的结构,在5 eV时仍观察到明显的碳溅射。在所有研究的冲击能量下,硅溅射都可以忽略不计。对于W自溅射,对于法向入射,在大于或等于1 keV的情况下观察到高于1的溅射产率;对于偏离法向入射的20度,在大于或等于500 eV的情况下,观察到溅射率高于1。 (C)2003 Elsevier Science B.V.保留所有权利。 [参考:34]

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