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首页> 外文期刊>Journal of Non-Crystalline Solids: A Journal Devoted to Oxide, Halide, Chalcogenide and Metallic Glasses, Amorphous Semiconductors, Non-Crystalline Films, Glass-Ceramics and Glassy Composites >Photo-probe study of siloxane polymers: low-temperature structural relaxation in siloxane polymers probed by persistent spectral hole burning
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Photo-probe study of siloxane polymers: low-temperature structural relaxation in siloxane polymers probed by persistent spectral hole burning

机译:硅氧烷聚合物的光探针研究:通过持久光谱空穴燃烧探测硅氧烷聚合物中的低温结构弛豫

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摘要

We have investigated low-temperature structural relaxation in polysiloxane matrices by using persistent spectral hole burning (PSHB). The irreversible increase in hole width and the irreversible decrease in hole area were evaluated in terms of PSHB temperature-cycling experiments starting at 4 or 20 K. MQ-type silicone resins containing cross-linked nanoparticles (an uncured prepolymer mixture and cured MQ resins) and poly(methylphenylsiloxane) (PMPS) were used. The increase in hole width was observed at 15-20 K for all measured polysiloxanes. The increase is attributed to the local relaxation originating from the siloxane chains. The local structural relaxation of siloxane chains in this temperature range is confirmed for the first time. The local structural relaxation observed in the PSHB can be related to the rapid decrease in the final cis fraction between 4 and 20 K observed in the previous azobenzene photo-isomerization study. The curing effects of the MQ resin on the local relaxation are also discussed. (C) 2000 Elsevier Science B.V. All rights reserved. [References: 40]
机译:我们已经通过使用持久光谱空穴燃烧(PSHB)研究了聚硅氧烷基质中的低温结构弛豫。从4或20 K开始的PSHB温度循环实验评估了孔宽度的不可逆增加和孔面积的不可逆减少。含有交联纳米粒子的MQ型有机硅树脂(未固化的预聚物混合物和固化的MQ树脂)和聚(甲基苯基硅氧烷)(PMPS)被使用。对于所有测得的聚硅氧烷,在15-20K处观察到孔宽度的增加。该增加归因于源自硅氧烷链的局部松弛。首次确认了该温度范围内硅氧烷链的局部结构松弛。在PSHB中观察到的局部结构松弛可能与在先前的偶氮苯光异构化研究中观察到的最终顺式分数在4至20 K之间的快速降低有关。还讨论了MQ树脂对局部松弛的固化作用。 (C)2000 Elsevier Science B.V.保留所有权利。 [参考:40]

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