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首页> 外文期刊>Journal of Non-Crystalline Solids: A Journal Devoted to Oxide, Halide, Chalcogenide and Metallic Glasses, Amorphous Semiconductors, Non-Crystalline Films, Glass-Ceramics and Glassy Composites >Redox processes in a tin doped melt with the basic composition 20Na(2)O center dot 8OSiO(2) studied by square-wave voltammetry and impedance spectroscopy
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Redox processes in a tin doped melt with the basic composition 20Na(2)O center dot 8OSiO(2) studied by square-wave voltammetry and impedance spectroscopy

机译:方波伏安法和阻抗谱研究基本成分为20Na(2)O中心点8OSiO(2)的锡掺杂熔体中的氧化还原过程

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摘要

Redox processes in a tin doped melt with the basic composition 20Na(2)O center dot 80SiO(2) were studied by square-wave voltammetry and impedance spectroscopy. At temperatures of 1350 and 1450 degrees C, the recorded square-wave voltammograms exhibited a distinct peak attributed to the reduction of Sn4+ to Sn2+. Impedance spectra recorded at the same temperatures could be simulated with a simple equivalent circuit assuming a diffusion controlled electrode reaction. At temperatures T <= 1250 degrees C and small step times, the voltammograms exhibited a second peak which was much stronger affected by the frequency (step time) applied than expected from a diffusion controlled electron transfer reaction. In order to fit the impedance spectra at these temperatures, a more complex equivalent circuit was necessary, taking into account adsorption phenomena. In all impedance spectra, the Warburg parameter obtained from simulation, which stands for the diffusion from and to the electrode, exhibited a minimum which was equal to the voltammetric peak at more negative potentials. The voltammetric peak at less negative potentials is caused by the reduction of Sn4+ to an adsorbed state. Within this reduction step, a monolayer of Sn2+ species is formed. (c) 2005 Elsevier B.V. All rights reserved.
机译:通过方波伏安法和阻抗谱研究了基本成分为20Na(2)O中心点80SiO(2)的锡掺杂熔体中的氧化还原过程。在1350和1450摄氏度的温度下,记录的方波伏安图显示出一个明显的峰,这归因于Sn4 +还原为Sn2 +。假设扩散控制了电极反应,可以用简单的等效电路模拟在相同温度下记录的阻抗谱。在温度T <= 1250摄氏度且步长时间短的情况下,伏安图显示出第二个峰,该峰受施加的频率(步长时间)的影响比扩散控制电子转移反应的预期强得多。为了使阻抗谱适合这些温度,考虑到吸附现象,需要使用更复杂的等效电路。在所有阻抗谱中,从模拟获得的Warburg参数代表电极之间的扩散,并显示出最小值,该最小值等于负电位下的伏安峰。负电位较低时的伏安峰是由Sn4 +还原为吸附态引起的。在该还原步骤中,形成了单层的Sn2 +物质。 (c)2005 Elsevier B.V.保留所有权利。

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