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Float reaction between sodium aluminoborosilicate glassmelts and copper-base liquid metal alloys

机译:铝硼硅酸钠玻璃熔体与铜基液态金属合金之间的漂浮反应

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摘要

Wavelength-dispersive X-ray spectroscopy (WDS) has been utilized in a study of redox chemical diffusion dynamics in reaction couples of two sodium aluminoborosilicate glassmelts - both lightly doped with Fe3+ - with two copper-base liquid metal alloys: Cu-37 at.%Ge and Cu-36 at.%Sn. The glassmelts were floated on the alloys for 30 min in a controlled, reducing atmosphere at temperatures in the range 1200-1350 &DEG; C. Despite there being a significant driving potential to incorporate Cu+.2+ into the glassmelt, such does not occur: ionic Cu concentration in the glassmelts was below the detection limits of WDS (i.e., X-Cu < 100 ppm atomic). As a generalization, the Ge2+.4+ and Sn2+.4+ diffused into the glassmelt to a depth of &SIM; 50 μ m, a distance similar to that seen for ionic Sn in the soda-lime silicate on pure Sn float process that is operated at notably lower temperatures and for dramatically shorter reaction times. For reactions with Cu-37 at.%Ge, doping the glass with ferric iron had a profound effect on the depth of penetration Ge4+, a network of ionic Ge, decreasing it significantly: Fe3+ acts as an electron acceptor from Ge2+; the resultant tetravalent cation (Ge-4, a network former) is all-but immobile. A similar result was not seen for reactions with the Cu-Sn alloy, a consequence of considerable reduction of the glassmelt by its pre-reaction with molybdenum components of a delivery system. The reaction morphologies seen are consistent with the Wagner/Schmalzried formulation for dynamic redox reactions. © 2005 Elsevier B.V. All rights reserved.
机译:波长色散X射线光谱法(WDS)已用于研究两种铝硼硅酸钠玻璃熔体(均轻掺杂Fe3 +)和两种铜基液态金属合金Cu-37 at的反应对中氧化还原化学扩散动力学。 %Ge和Cu-36 at。%Sn。将玻璃熔体在受控的还原性气氛中在1200- 1350℃的温度下漂浮在合金上30分钟。 C.尽管有很大的驱动潜力将Cu + .2 +掺入玻璃熔体中,但不会发生这种情况:玻璃熔体中的离子铜浓度低于WDS的检测限(即X-Cu&LT; 100 ppm原子)。概括地说,Ge2 + .4 +和Sn2 + .4 +扩散到玻璃熔体中的深度为&SIM; 50μm,该距离类似于在纯锡浮法中的钠钙硅酸盐中离子锡所见的距离,该温度显着降低,反应时间大大缩短。对于与Cu-37 at。%Ge的反应,用铁铁掺杂玻璃对渗透Ge4 +的深度有深远影响,Ge4 +是离子Ge的网络,使其显着降低:Fe3 +充当Ge2 +的电子受体。生成的四价阳离子(Ge-4,网络形成剂)几乎不动。与Cu-Sn合金的反应未见类似结果,这是由于玻璃熔体与输送系统中的钼组分发生预反应而大大减少了玻璃熔体的结果。看到的反应形态与用于动态氧化还原反应的Wagner / Schmalzried配方一致。 &复制; 2005 Elsevier B.V.保留所有权利。

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