Soldering a 3D Wire Lattice Structure

摘要

Soldering the junctions in a novel woven structure constructed from metallic wires is expected to significantly enhance the mechanical properties of that structure. The ideal bond geometry has solder localized at wire junctions and a uniform amount of solder at each junction throughout the structure. By examining the effects of solvent variations, liquid flux concentration, and solder powder concentration on the soldered joint geometry and distribution, we have developed a new procedure to bond these wire junctions using a very fine solder powder suspended in a flux solution.