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首页> 外文期刊>Journal of Materials Engineering and Performance >Hot Tensile Deformation Characteristics and Processing Map of Extruded AZ80 Mg Alloys
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Hot Tensile Deformation Characteristics and Processing Map of Extruded AZ80 Mg Alloys

机译:挤压AZ80镁合金的热拉伸变形特性及加工图

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摘要

The hot deformation behaviors of extruded AZ80 Mg alloys were investigated using tension tests. True stress-true strain curves were obtained for deformation at temperatures from 250 to 450℃ with the strain rate range from 0.001 to 0.08 s~(-1). Optical microscopy analysis was performed to correlate microstructural changes to the flow behaviors. Based on the flow stress, the processing map at a strain of 0.18 was developed using the dynamic materials model theory and can be divided into three zones, including stability zones, change-over region, and instability zones. In stability zones, there are two dynamic recrystallization regions: one region with a peak efficiency of 58% at 350℃ and a strain rate of 0.001 s~(-1) called domain I; another region with a peak efficiency of 58% at 400℃ and a strain rate of 0.01 s~(-1) taken as domain II. The apparent activation energy for domain I was estimated to be 100.71 kJ/mol, indicating that short-circuit diffusion process is along the grain boundaries and falls at lower temperatures and lower strain rates. A lattice self-diffusion is considered to be rate controlling mechanism with the apparent activation energy estimated as 140.32 kJ/mol at higher temperatures and higher strain rates in domain II. The change-over region is the zone from domain I to domain II, in which the grains abnormally grow. In instability zones, twins, local deformation band, wedge cracking, and matrix cracking were observed, suggesting that these processing parameters for hot tension in this zone are inapplicable.
机译:使用拉伸试验研究了挤压的AZ80 Mg合金的热变形行为。得出了在250〜450℃温度范围内变形的真实应力-真实应变曲线,应变率范围为0.001〜0.08 s〜(-1)。进行光学显微镜分析以使微观结构变化与流动行为相关。基于流动应力,使用动态材料模型理论绘制了应变为0.18时的加工图,该加工图可分为三个区域,包括稳定区域,转换区域和不稳定区域。在稳定区中,有两个动态再结晶区域:一个区域在350℃时峰值效率为58%,应变速率为0.001 s〜(-1),称为畴I;第二区域为动态再结晶区域。另一个区域在400℃时的峰值效率为58%,应变率为0.01 s〜(-1)作为区域II。域I的表观活化能估计为100.71 kJ / mol,表明短路扩散过程沿晶界,并在较低的温度和较低的应变速率下下降。晶格自扩散被认为是速率控制机制,在域II中较高的温度和较高的应变速率下,视在活化能估计为140.32 kJ / mol。转换区域是从晶粒I到晶粒II异常生长的区域。在不稳定区域中,观察到孪晶,局部形变带,楔形裂纹和基体裂纹,这表明该区域中用于热张力的这些加工参数不适用。

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