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首页> 外文期刊>Journal of Materials Engineering and Performance >Microstructure and Hardness of Copper Powders Consolidated by Plasma Pressure Compaction
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Microstructure and Hardness of Copper Powders Consolidated by Plasma Pressure Compaction

机译:等离子体压制固结铜粉的组织和硬度

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Bulk fine-grained copper samples were prepared by consolidating copper powders using the technique of plasma pressure compaction (P~2C). The specimens were obtained by consolidating the powder particles under conditions of electrical pulse and no-electrical pulse and at two different temperatures. Results reveal that pulsing of the powders prior to consolidation led to higher microhardness values than the samples that were obtained by consolidating the powder particles under no-plus. Both nanohardness and microhardness increased with an increase in the temperature of consolidation. Samples consolidated at the higher temperature revealed evidence of grain coarsening. The influence of processing. Variables on microstructure development and hardness is presented and discussed.
机译:使用等离子压紧(P〜2C)技术将铜粉固结,制成块状细晶粒铜样品。通过在电脉冲和非电脉冲的条件下以及在两个不同的温度下固结粉末颗粒来获得样品。结果表明,固结之前粉末的脉动导致的显微硬度值高于零下通过固结粉末颗粒获得的样品。纳米硬度和显微硬度都随着固结温度的升高而增加。在较高温度下固结的样品显示出晶粒粗化的迹象。加工的影响。介绍和讨论了有关微观组织发展和硬度的变量。

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