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Thiol-containing polymeric embedding materials for nanoskiving

机译:用于纳米切削的含硫醇的聚合物包埋材料

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This paper describes the characterization of new embedding resins for nanoskiving (ultramicrotomy) that contain thiols. Nanoskiving is a technique to produce nanoscale structures using an ultramicrotome to section thin films of materials (e.g., gold) embedded in polymer. Epoxies are used typically as embedding resins for microtomy. Epoxies, however, do not adhere well to gold or other smooth metallic structures that are used commonly for nanoskiving. Thiol-ene and thiol-epoxy polymers provide improved adhesion to gold due to the thiol functional group. In addition, the thiol-ene polymers can be prepared within minutes using photopolymerization, which allows for rapid prototyping. Two commercial thiol-containing adhesives were evaluated as resins in addition to several formulations of commercially available monomers. The important physical and mechanical properties for microtomy of these unconventional embedding resins were characterized and the properties were compared to commercial epoxy resins. Gold nanowires were fabricated using nanoskiving of gold films embedded in these unconventional resins. These studies show that a 3 :4 mixture of thiol (pentaerythritol tetra(3-mercaptopropionate)) and ene (triailyl-1,3,5-triazine-2,4,6-trione) works very well as a resin for nanoskiving and provides improved adhesion and reduced preparation time relative to epoxies.
机译:本文介绍了用于纳米切削(超薄切片术)的新型包埋树脂的特性,这些树脂包含硫醇。纳米刮削是一种使用超薄切片机对嵌入聚合物中的材料(例如金)的薄膜进行切片来产生纳米级结构的技术。环氧树脂通常用作切片机的包埋树脂。但是,环氧树脂不能很好地粘附在通常用于纳米切削的金或其他光滑金属结构上。由于硫醇官能团,硫醇-烯和硫醇-环氧聚合物可改善对金的附着力。另外,可以使用光聚合在几分钟内制备硫醇-烯聚合物,这允许快速成型。除了几种市售单体的配方外,还评估了两种市售含硫醇的粘合剂作为树脂。表征了这些非常规包埋树脂的切片术的重要物理和机械性能,并将这些性能与市售环氧树脂进行了比较。金纳米线是利用嵌入这些非常规树脂中的金膜的纳米刮削加工而成的。这些研究表明,硫醇(季戊四醇四(3-巯基丙酸酯))和烯(三ailyl-1,3,5-三嗪-2,4,6-三酮)的3:4混合物非常适合用作纳米切削和脱脂的树脂。相对于环氧树脂,可提供更好的附着力并减少制备时间。

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