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首页> 外文期刊>Journal of Materials Chemistry, A. Materials for energy and sustainability >Effects of a ferroelectric interface on thermionic injection-induced cooling in single-heterojunction devices based on thin-film electrode/medium/electrode design
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Effects of a ferroelectric interface on thermionic injection-induced cooling in single-heterojunction devices based on thin-film electrode/medium/electrode design

机译:铁电界面对基于薄膜电极/介质/电极设计的单异质结器件中热离子注入诱导冷却的影响

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This paper reports experimental studies on the effects of a ferroelectric interface on thermionic cooling in single-heterojunction electrode/medium/electrode thin-film devices by using high-dielectric MoO3 oxide and a ferroelectric P(VDF-TrFE) polymer. We observe a thermionic cooling of 0.10 degrees C from the single Au/MoO3/ITO device at a low injection current of 0.50 mA cm(-2). The experimental studies at different film thicknesses and current densities suggest that this cooling effect is determined by three competing processes: phonon absorption from injected carriers through a thermionic process via charge-phonon interactions, Joule heating from the electrical transport of injected carriers, and heat transfer between charge-injecting and charge-collecting electrodes through phonon conduction. Furthermore, we find that inserting a ferroelectric polymer [P(VDF-TrFE)] interface can largely enhance the thermionic cooling from 0.10 degrees C to 0.20 degrees C by a factor of 2 in the Au/P(VDF-TrFE)/MoO3/ITO device at a very low injection current of 0.15 mA cm(-2), as compared with the Au/MoO3/ITO device without a ferroelectric interface. Our analysis indicates that the ferroelectric P(VDF-TrFE) interface can decrease the heat transfer between charge-injecting and charge-collecting electrodes due to its low thermal conductivity but still allow a thermionic injection due to its ferroelectric polarization to enhance the cooling effect. Therefore, our work presents a new approach to enhance the thermionic cooling effect by using a ferroelectric interface in organic heterojunction thin-film electronic devices.
机译:本文报道了使用高介电MoO3氧化物和铁电P(VDF-TrFE)聚合物对单电结电极/中/电极薄膜器件中铁电界面对热离子冷却的影响的实验研究。我们观察到在0.50 mA cm(-2)的低注入电流下,单个Au / MoO3 / ITO设备的热电子冷却为0.10摄氏度。在不同的膜厚度和电流密度下进行的实验研究表明,这种冷却效果是由三个竞争过程决定的:通过电荷-声子相互作用通过热电子过程从注入的载流子吸收声子,从注入的载流子的电传输产生的焦耳热以及传热通过声子传导在电荷注入和电荷收集电极之间此外,我们发现,插入铁电聚合物[P(VDF-TrFE)]界面可以在Au / P(VD​​F-TrFE)/ MoO3 /中将热电子冷却从0.10摄氏度提高到0.20摄氏度2倍。与没有铁电界面的Au / MoO3 / ITO设备相比,ITO设备在0.15 mA cm(-2)的极低注入电流下。我们的分析表明,铁电P(VDF-TrFE)界面由于其低导热性而可以减少电荷注入和电荷收集电极之间的热传递,但由于其铁电极化仍可以进行热电子注入,从而增强了冷却效果。因此,我们的工作提出了一种通过在有机异质结薄膜电子设备中使用铁电界面来增强热电子冷却效果的新方法。

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