Preparation and Characterization of Copper Nanowire/Polyamide 6 Nanocomposites and Its Properties

摘要

Copper nanowire/polyamide 6 (denoted as nano-Cu/PA6) nanocomposites were readily prepared via in situ polymerization in reducing atmosphere. The microstructure, phase composition, and chemical state of typical elements of as-prepared nano-Cu/PA6 nanocomposites were analyzed by transmission electron microscopy, and X-ray diffraction, while their thermal stability and crystallization behaviors were evaluated by thermogravimetric analysis and differential scanning calorimetry. Moreover, the mechanical strength of as-prepared nano-Cu/PA6 nanocomposites was determined with a universal testing machine, and their friction and wear behaviors were evaluated with an MRH-3 high speed block-on-ring test rig. Findings indicate that copper nanowire is coated by surrounding molecular chains of PA6 and well disperses in the polymeric matrix. Besides, copper nanowire consists of metallic copper, which indicates that copper nanowire coated by PA6 matrix has good chemical stability and is not oxidized during the preparation of the title nanocomposites under high-temperature reactions. Furthermore, copper nanowire filler is able to remarkably improve the mechanical strength and wear resistance of polyamide 6. Particularly, nano-Cu/PA6 composite containing 0.5% (mass fraction) copper nanowire possesses the maximum tensile strength (its tensile strength is higher than that of pure PA6 by 77.41%); and its friction coefficient and wear scar diameter are also much smaller than those of PA6.