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首页> 外文期刊>Journal of Materials Science >Relationship between deposition and recrystallization textures of copper and chromium electrodeposits
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Relationship between deposition and recrystallization textures of copper and chromium electrodeposits

机译:铜和铬电沉积物的沉积和再结晶织构之间的关系

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摘要

The <100>, <111> and <110> textures of copper electrodeposits obtained from copper sulfate baths changed to the <100>, <100> and <3~(1/2)10> textures, respectively, after recrystallization. The textures of chromium electrodeposits obtained from the standard Sargent bath remained unchanged after recrystallization. The results are in agreement with the prediction of the strain energy release maximization model, in which the recrystallized grains orient themselves so that their minimum elastic modulus direction can be parallel to the absolute maximum internal stress direction due to dislocations in the non-recrystallized grains.
机译:从硫酸铜浴获得的铜电沉积物的<100>,<111>和<110>织构在重结晶后分别变为<100>,<100>和<3〜(1/2)10>织构。重结晶后,从标准Sargent浴中获得的铬电沉积物的质地保持不变。结果与应变能释放最大化模型的预测一致,在该模型中,由于未结晶晶粒中的位错,使再结晶晶粒自身定向,使其最小弹性模量方向可以平行于绝对最大内应力方向。

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