Creep behavior of the lead-free Sn-5%Sb solder alloy was studied by long time Vickers indentation testing at room temperature. Based on the steady-state power law creep relationship, the stress exponents were determined for the cast and wrought materials in the homogenized and unhomogenized conditions. The stress exponent values of 4.5 and 12, depending on the processing route of the material, are in good agreement with those reported for the same material in conventional creep testing at room temperature. The results are discussed on the basis of the microstructural features developed during different processing routes of the material. (c) 2005 Springer Science + Business Media, Inc.
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机译：通过长时间的维氏压痕测试，在室温下研究了无铅Sn-5％Sb焊料合金的蠕变行为。基于稳态幂律蠕变关系，确定了均质和非均质条件下铸造和锻造材料的应力指数。取决于材料的加工路线，应力指数值4.5和12与在室温下常规蠕变测试中针对相同材料报道的应力指数非常吻合。基于在材料的不同加工路线中形成的微观结构特征来讨论结果。 （c）2005年Springer Science + Business Media，Inc.
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