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Excimer laser micromachining for 3D microstructure

机译:用于3D微结构的准分子激光微加工

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摘要

A new 3D micromachining method, called Hole Area Modulation (HAM), has been introduced to enhance the current micromachining technology. In this method, information on the machining depth is converted to the sizes of holes on the mask. The machining is carried out with a simple 2D movement of the workpiece or the mask. This method can be applied for machining various kinds of microcavities in various materials. In this paper, a mathematical model for excimer laser micromachining based on HAM and determination of the optimal laser ablation conditions (hole diameter, step size, mask movement velocity, etc.) are described. The simulation and experiment of the HAM-based laser ablation were carried out successfully to create microlens.
机译:引入了一种称为孔面积调制(HAM)的新3D微加工方法,以增强当前的微加工技术。在这种方法中,有关加工深度的信息将转换为掩模上孔的大小。加工是通过工件或掩模的简单二维运动来进行的。该方法可用于在各种材料中加工各种微腔。在本文中,描述了一种基于HAM的准分子激光微加工的数学模型,并确定了最佳激光烧蚀条件(孔径,步长,掩模移动速度等)。成功地进行了基于HAM的激光烧蚀的仿真和实验,以创建微透镜。

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