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首页> 外文期刊>Journal of Materials Processing Technology >Joining of Si{sub}3N{sub}4 using rapidly-solidified CuNiTiB brazing filler foils
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Joining of Si{sub}3N{sub}4 using rapidly-solidified CuNiTiB brazing filler foils

机译:使用快速凝固的CuNiTiB钎焊填充箔连接Si {sub} 3N {sub} 4

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摘要

Joining of Si{sub}3N{sub}4 to Si{sub}3N{sub}4 was performed using newly developed rapidly-solidified CuNiTiB brazing foils of different thickness, three-point bending tests then being employedat room temperature to measure the strength of the joints. The microstructures of the joints wereobserved and the element area distribution of Cu, Ni and Ti was examined by scanning electronmicroscope with an X-ray wave-dispersion spectrometer. The results of the strength test show thatwhen using rapidly-solidified brazing filler foils of suitable thickness (for example, 40μm and 80 μm) the joint strength was increased greatly (up to 402 MPa and 380 MPa respectively) compared withthe use of paste brazing filler of the same alloy. Moreover, the fracture form of theSi{sub}3N{sub}4/Si{sub}3N{sub}4 joints also varied with the change of strength. The thickness ofthe brazing foils used has an important effect on the corresponding joint strength, reasons for whichare discussed.
机译:使用新开发的不同厚度的快速凝固的CuNiTiB钎焊箔将Si {sub} 3N {sub} 4连接到Si {sub} 3N {sub} 4,然后在室温下进行三点弯曲测试以测量强度的关节。观察接头的微观结构,并用X射线波谱仪通过扫描电镜观察Cu,Ni和Ti的元素面积分布。强度测试结果表明,与使用糊状钎料相比,当使用适当厚度(例如40μm和80μm)的快速固化钎料箔时,接头强度大大提高(分别达到402 MPa和380 MPa)。相同的合金。此外,Si {sub} 3N {sub} 4 / Si {sub} 3N {sub} 4接头的断裂形式也随强度的变化而变化。所使用的钎焊箔的厚度对相应的接头强度具有重要影响,对此进行了讨论。

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