Hardware solutions for the 65k pixel X-ray camera module of 75 μm pixel size

摘要

We present three hardware solutions designed for a detector module built with a 2 cm ×2 cm hybrid pixel detector built from a single 320 or 450 μm thick silicon sensor designed and fabricated by Hamamatsu and two UFXC32k readout integrated circuits (128×256 pixels with 75μm pitch, designed in CMOS 130 nm at AGH-UST). The chips work in a single photon counting mode and provide ultra-fast X-ray imaging. The presented hardware modules are designed according to requirements of various tests and applications: ? Device A: a fast and flexible system for tests with various radiation sources. ? Device B: a standalone, all-in-one imaging device providing three standard interfaces (USB 2.0, Ethernet, Camera Link) and up to 640 MB/s bandwidth. ? Device C: a prototype large-area imaging system. The paper shows the readout system structure for each case with highlighted circuit board designs with details on power distribution and cooling on both FR4 and LTCC (low temperature co-fired ceramic) based circuits.