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首页> 外文期刊>Journal of instrumentation: an IOP and SISSA journal >Performance and qualification of CdTe pixel detectors for the Spectrometer/Telescope for Imaging X-rays
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Performance and qualification of CdTe pixel detectors for the Spectrometer/Telescope for Imaging X-rays

机译:用于成像X射线的光谱仪/望远镜的CdTe像素检测器的性能和鉴定

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The Spectrometer/Telescope for Imaging X-rays (STIX) is a remote sensing instrument on-board the ESA Solar Orbiter spacecraft. STIX is designated to the study of energetic phenomena in solar flares. A Fourier-imaging technique using tungsten grid collimators in front of CdTe pixel detectors is employed, covering the 4 to 150 keV energy range with a full-width-half maximum resolution around 1 keV at low energies. Acrorad CdTe detectors of 1mm thickness with a planar aluminum Schottky contact are used as basis for a subsequent patterning process into eight large pixels, four small pixels, and a guard ring. The patterning is done by means of microfabrication technologies. The area of the patterned sensor is 10×10mm~2. Test equipment has been developed for selecting the detectors with best performance prior to integration with the read-out system, and for qualification purposes. The set-up allows pixel-based dark current measurements at low temperatures. Pixel dark currents below 60 pA are needed to avoid excess noise in the read-out ASIC. The best pixels show dark currents below 10 pA at 300 V bias and ?20°C. Spectroscopic measurements with ~(133)Ba sources confirm the good performance. This paper briefly explains the mission context of the CdTe detectors and then gives details of the production and testing procedures. Typical results are shown, with emphasis on performance degradation studies from displacement damage by proton irradiation. This is expected to be the dominant degradation mechanism for this application.
机译:用于成像X射线的光谱仪/望远镜(STIX)是ESA太阳轨道飞行器航天器上的遥感仪器。 STIX被指定用于研究太阳耀斑中的能量现象。采用了在CdTe像素检测器之前使用钨栅准直器的傅里叶成像技术,该技术覆盖了4至150 keV的能量范围,在低能量下具有大约1 keV的全宽一半的最大分辨率。具有平面铝肖特基触点的厚度为1mm的Acrorad CdTe检测器用作后续图案化过程的基础,该过程分为八个大像素,四个小像素和一个保护环。图案化是通过微加工技术完成的。图案传感器的面积为10×10mm〜2。已经开发了测试设备,用于在与读出系统集成之前选择性能最佳的检测器,并用于鉴定目的。该设置允许在低温下基于像素的暗电流测量。需要低于60 pA的像素暗电流,以避免读出ASIC中产生过多的噪声。最佳像素在300 V偏置电压和±20°C时显示低于10 pA的暗电流。用〜(133)Ba离子源进行光谱测量证实了良好的性能。本文简要介绍了CdTe检测器的任务环境,然后详细介绍了生产和测试程序。显示了典型的结果,重点是由于质子辐照引起的位移破坏而导致的性能下降研究。预计这是此应用程序的主要降级机制。

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