A Study on Fabricating Microdeep Recessed Part on Copper Foil Using Laser Indirect Shock Forming

摘要

Laser indirect shock forming is a novel microfabrication technique to introduce 3D profiles in metallic thin films. Experiments were performed by allowing the laser-driven flyer to impact the thin film, which is placed above a micromould. The effects of laser energy and sample thickness on deformation mechanism were investigated experimentally. The experimental results show that increasing the laser energy could increase the deformation depth, but may induce fracture along the edges of the micromould when the laser energy is too high. Moreover, the target plate was completely sheared off for 10 μm copper when the pulse energy is 1200 ml. So it can be found that the technique can also realize micro punching of metallic thin films. The transient deformation of copper foil impacted by laser-driven flyer is simulated in this paper. Experimental data obtained were then used to validate the corresponding simulation model. Good agreement has been obtained between the numerical simulation and the experiments under different laser energy. The rising temperature due to the adiabatic conditions is taken into account. And the strain distribution has been also calculated numerically.