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Interaction of the copper(II) macrocyclic complexes with DNA studied byfluorescence quenching of ethidium

机译:乙锭荧光猝灭研究铜(II)大环配合物与DNA的相互作用

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摘要

The fluorescence quenching of DNA bound ethidium ion by copper(II) macrocyclic complexes has been investigated. The binding constant indicates that the stable assembly can be formed between the DNA and the metal complex. The replacement of the fluorophore by the metal complexes results in a decrease of the ethidium moles intercalating to the molar DNA base pair and the binding constant of the ethidium to the DNA. The quenching of the ethidium excited state by the Cu(II) complex follows linear Stern-Volmer behavior. The quenching constant decreases regularly with an increase of the ratio of the concentration of the bound ethidium to that of DNA base pair. The dependence of the quenching constant on the ratio can be used to estimate binding constants for the fluorescent molecule and metal complexes to DNA. This method does not depend strongly on the type and the extent of interaction of metal complexes with DNA, allowing for the determination of binding constants for metal complexes that exhibit small changes in absorption spectra upon binding. The precision of this method will ultimately be governed by outstanding agreement between the quenching constant measured and that calculated by using a correlation function of the ratio or the DNA bound concentration of ethidium with quenching constant.
机译:已经研究了铜(II)大环配合物对DNA结合的乙锭离子的荧光猝灭。结合常数表明可以在DNA和金属络合物之间形成稳定的装配。用金属络合物代替荧光团导致插入摩尔的DNA碱基对的乙啶摩尔的减少以及乙锭与DNA的结合常数。 Cu(II)络合物对乙炔激发态的猝灭遵循线性Stern-Volmer行为。淬灭常数随着结合的乙锭与DNA碱基对的浓度之比的增加而规则地降低。猝灭常数对比率的依赖性可以用于估计荧光分子和金属络合物与DNA的结合常数。该方法在很大程度上不取决于金属络合物与DNA相互作用的类型和程度,从而可以确定在结合后吸收光谱变化很小的金属络合物的结合常数。该方法的精度最终将由测得的猝灭常数与通过使用比率或与猝灭常数的DNA结合的浓度的相关函数计算出的猝灭常数之间的显着一致性来控制。

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