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首页> 外文期刊>Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena >Field emission characteristics of AIN coated silicon nanocone arrays
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Field emission characteristics of AIN coated silicon nanocone arrays

机译:AIN涂层硅纳米锥阵列的场发射特性

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摘要

Nanoscaled silicon cone arrays were formed on mirror-polished silicon wafers by plasma etching using hot filament chemical vapor deposition (HFCVD) system. A mixture of CH4and H2 was introduced during silicon cone formation. AIN films were coated on Si cone arrays using radio frequency (RF) magnetron sputtering system. Scanning electrons microscopy (SEM) was employed to characterize the morphology of silicon cone arrays before and after AIN coating. The field emission characteristics of AIN coated silicon cone arrays, uncoated silicon cone arrays and AlN films were studied and compared, and the silicon cone arrays with AIN coating showed the best enhanced electron emission properties due to the negative electron affinity of AIN coating layer and the high aspect ratio of silicon cone. For AIN coated silicon cone arrays, a slight hysteresis between the upward and downward voltage sweeps was also observed and the field emission currents from AIN coated Si nanocone arrays decreased with the increase of the thickness of AIN films, which could be mainly attributed to the space charge buildup in AIN film with wide band gap.
机译:使用热丝化学气相沉积(HFCVD)系统通过等离子刻蚀在镜面抛光的硅晶片上形成纳米级硅锥阵列。在硅锥形成过程中引入了CH4和H2的混合物。使用射频(RF)磁控溅射系统将AIN膜涂覆在Si锥阵列上。扫描电子显微镜(SEM)用于表征AIN涂层之前和之后的硅锥阵列的形貌。对AIN涂层的硅锥阵列,未涂层的硅锥阵列和AlN薄膜的场发射特性进行了研究和比较。硅锥的高纵横比。对于AIN涂层硅锥阵列,在向上和向下的电压扫描之间也观察到轻微的磁滞现象,并且随着AIN膜厚度的增加,来自AIN涂层硅纳米锥阵列的场发射电流减小,这可能主要归因于空间带有宽带隙的AIN膜中电荷积累。

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