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Mechanical Spectroscopy of Pure and Fe-Doped InP Films on Silicon Cantilevers

机译:硅悬臂上纯Fe掺杂InP膜的机械光谱

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摘要

The vibrating-reed technique (frequencies 100 Hz to 10 kHz) has been applied to investigate pure and Fe-doped heteroepitaxial InP films (thickness ≈ 3 μm) on microstructurized Si substrate cantilevers (thickness ≈ 35 μm; strain amplitudes 10~(-6) to 10~(-3) at temperature between -160 and 235 ℃. The eigenfrequencies are used to determine Young's modulus of the film. The variation of the loss modulus with temperature and with vibration amplitude is measured and discussed in terms of dislocation motion and multiplication in the InP film considering the effect of iron doping.
机译:振动簧片技术(频率为100 Hz至10 kHz)已用于研究微结构化Si衬底悬臂(厚度≈35μm;应变幅度为10〜(-6)上的纯Fe掺杂Fe异质外延InP膜(厚度≈3μm)到-160〜235℃之间的10〜(-3),用本征频率确定薄膜的杨氏模量,测量损耗模量随温度和振动幅度的变化,并根据位错运动进行讨论。考虑到铁掺杂的影响,在InP薄膜中进行扩散和扩散。

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