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首页> 外文期刊>Journal of Electronic Materials >Silver Particle Carbon-Matrix Composites as Thick Films for Electrical Applications
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Silver Particle Carbon-Matrix Composites as Thick Films for Electrical Applications

机译:银颗粒碳基复合材料作为电气应用的厚膜

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摘要

Silver particle (3 (mu)m) carbon-matrix composites in the form of thick films (around 100 (mu)m thick) on alumina, as prepared from pastes comprising silver and mesophase pitch particles (14 (mu)m), have been attained. The films on alumina were fired at 650 deg C in nitrogen to convert pitch to carbon. The volume electrical resistivity attained ranged from 10~(-5) OMEGA cm to 10~(4) OMEGA cm, depending on the silver volume fraction. The percolation threshold was 12 vol(percent) silver.
机译:由包含银和中间相沥青颗粒(14μm)的浆料制备的氧化铝上的厚膜形式(约100μm厚)的银颗粒(3μm)碳基复合材料具有被实现。氧化铝上的薄膜在650摄氏度的氮气中煅烧,将沥青转化为碳。取决于银的体积分数,获得的体积电阻率在10〜(-5)OMEGA cm至10〜(4)OMEGA cm的范围内。渗滤阈值为12 vol(%)银。

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