Effect of Substrate Material on Fatigue Crack Propagation Rate of Adhesively Bonded DCB Joints

摘要

The effect of substrate material on the fatigue crack propagation rate was investigated using adhesively bonded DCB specimens with CFRP and aluminum substrates. The experimental results show that the increase in thickness of the adherend lowers the fatigue threshold, ΔG_(th), and raises the crack growth parameter, n, irrespective of the substrate material, and that the crack growth parameter, n, for the aluminum joints is less than that for the CFRP joints. To elucidate the fatigue crack propagation behavior, fracture surface observation and finite element analysis have been conducted. Besides, Gurson's model is applied to the adhesive layer. SEM images show that numerous voids are formed in the fracture surface for the joints with aluminum substrate, but the growth of voids is suppressed for the joints with CFRP substrate. FEM results also show that the void area fraction for the joint with aluminum substrate is greater than that with CFRP substrate. Thus, the above experimental and numerical trends of voids correspond to the trends of the fatigue crack propagation behavior.