首页> 外文期刊>Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology >Surface Modification of Poly(biphenyl dianhydride-para- phenylene diamine) (BPDA-PDA) and Poly(pyromellitic dianhydride-oxydianiline) (PMDA-ODA) Polyimides with UV Photo-Oxidation
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Surface Modification of Poly(biphenyl dianhydride-para- phenylene diamine) (BPDA-PDA) and Poly(pyromellitic dianhydride-oxydianiline) (PMDA-ODA) Polyimides with UV Photo-Oxidation

机译:聚(联苯二酐-对亚苯基二胺)(BPDA-PDA)和聚(苯四酸二酐-氧化二苯胺)(PMDA-ODA)聚酰亚胺的表面改性,具有紫外光氧化作用

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摘要

Poly(biphenyl dianhydride-para-phenylene diamine) (BPDA-PDA), Upilex-S, and poly(pyromellitic dianhydride-oxydianiline) (PMDA-ODA), Kapton HN, polyimides (PIs), were exposed to 253.7 nm and broad band radiation centered at 300 nm UV radiation which photo-activated the polymer surfaces in the presence of oxygen at atmospheric pressure. XPS analysis showed an increase in the O/C ratio on the modified surfaces which appeared mostly as the carbonyl moiety, although, treated Upilex-S samples also displayed an increase in C-O-C groups. The O/C ratio saturated more quickly for Upilex-S than Kapton. Good practical adhesion of sputtered Cu to the treated surfaces occurred at short treatment times while extensive exposure resulted in cohesive failure within the substrates at shorter treatment times for Upilex-S than Kapton.
机译:聚(联苯二酐-对苯二胺)(BPDA-PDA),Upilex-S和聚(均苯四甲酸二酐-二苯胺)(PMDA-ODA),Kapton HN,聚酰亚胺(PIs)暴露于253.7 nm和宽带辐射集中在300 nm紫外线辐射下,该辐射在大气压力下在氧气存在下光活化聚合物表面。 XPS分析显示,改性表面上的O / C比增加,主要表现为羰基部分,尽管经过处理的Upilex-S样品也显示C-O-C基团增加。 Upilex-S的O / C饱和度比Kapton更快。与Kapton相比,Upilex-S在更短的处理时间下,溅射的Cu在处理后的表面上具有良好的实用附着力,而大量暴露导致在较短的处理时间下基材内部的内聚力破坏。

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