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首页> 外文期刊>Journal of Applied Mechanics: Transactions of the ASME >Stress and Displacement Fields for Propagating the Crack Along the Interface of Dissimilar Orthotropic Materials Under Dynamic Mode I and II Load
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Stress and Displacement Fields for Propagating the Crack Along the Interface of Dissimilar Orthotropic Materials Under Dynamic Mode I and II Load

机译:在动态模式I和II载荷下沿正交异种材料界面扩展裂纹的应力和位移场

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摘要

General stress and displacement fields are derived as a crack steadily propagates along the interface of dissimilar orthotropic materials under a dynamic mode I and II load. They are obtained from the complex function formulation of steady plane motion problems for an orthotropic material and the complex eigenexpansion function. After the relationship between stress intensity factors and stress components for a propagating crack is defined, the stress, displacement components, and energy release rate with stress intensity factors are derived. The results are useful for both dissimilar isotropic and orthotropic and isotropic-orthotropic bimaterials, and homogeneous isotropic and orthotropic materials under subsonic crack propagation velocity.
机译:在动态模式I和II载荷下,裂纹沿着异种正交异性材料的界面稳定传播时,得出了一般应力和位移场。它们是从正交异性材料的稳态平面运动问题的复函数公式和复本征扩展函数获得的。定义了裂纹扩展的应力强度因子与应力分量之间的关系后,得出了应力,位移分量和能量释放率与应力强度因子的关系。该结果对于亚音速裂纹扩展速度下的各向同性和正交各向异性以及各向同性-正交各向异性双材料以及均质各向同性和正交各向异性材料都是有用的。

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