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Sugar Crystals as a Space Holder Material for Ti Void Metal Composites

机译:糖晶体作为Ti空隙金属复合材料的空间保持材料

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摘要

The paper presents a new procedure for void metal composite (VMC) formation. Table sugar crystals (saccharose) as a space holder material that forms voids around Ti scaffold have been used. In the process, the Ti with sugar particles were mixed together and uniaxially pressed to make green compacts composed of the Ti and sugar grains. The voids in the compacts were then made by dissolving sugar crystals in water. Such titanium scaffold was sintered at 1300 °C, and a Ti-VMC was made with homogenously distributed uniform voids of diameter of up to 1 mm. Sugar particles of polyhedral and spherical shape were applied for voids formation and the sugar shape was controlled by the sugar mixing process. Thus, after compacting of the Ti powder with proper sugar crystals, the voids of polyhedral or spherical shape were achieved. The authors show that the compression strength of the Ti-VMC of 75% porosity depends on the shape of the voids and is higher for polyhedral than for spherical sugar spacers, whereas the Young's modulus is higher for spherical voids.
机译:本文提出了一种新的形成空隙金属复合材料(VMC)的方法。已经使用了餐桌糖晶体(蔗糖)作为在Ti支架周围形成空隙的空间保持材料。在此过程中,将含糖的钛混合在一起并单轴压制成由钛和糖粒组成的生坯。然后通过将糖晶体溶解在水中来制造压块中的空隙。将这种钛支架在1300℃下烧结,并且制备Ti-VMC,其具有均匀分布的直径至多1mm的均匀空隙。应用多面体和球形糖颗粒形成空隙,并通过糖混合过程控制糖形状。因此,在用适当的糖晶体将Ti粉末压实之后,获得了多面体或球形的空隙。作者表明,孔隙度为75%的Ti-VMC的抗压强度取决于空隙的形状,多面体的抗压强度高于球形糖间隔物,而球形空隙的杨氏模量更高。

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