A photosensitive polysiloxaneimide precursor was synthesized from oxydianiline, bis(p-aminophenoxy)dimethylsilane, and a diacid chloride. This diacid chloride was prepared by the reaction of thionyl chloride with a diacid, which resulted from the reaction of pyromellitic dianhydride with hydroxyethylacrylate in N-methylpyrrolidone (NMP). The adhesion properties between polyimide and substrates such as SiO2 wafer were improved with introduction of siloxane moiety into the polyimide chain. The dielectric constant decreased with increasing siloxane moiety content. The photocrosslinking reaction results show that an 88-90% gel fraction was reached under the irradiation of a high-pressure mercury lamp. (C) 1995 John Wiley and Sons, Inc. [References: 10]
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机译：由氧化二苯胺，双（对氨基苯氧基）二甲基硅烷和二酰氯合成感光性聚硅氧烷酰亚胺前体。该二酰氯是由亚硫酰氯与二酸反应制得的，这是由均苯四酸二酐与丙烯酸羟乙酯在N-甲基吡咯烷酮（NMP）中反应而产生的。通过将硅氧烷部分引入聚酰亚胺链中，可改善聚酰亚胺与基材（例如SiO2晶片）之间的粘合性能。介电常数随硅氧烷部分含量的增加而降低。光交联反应结果表明，在高压汞灯的照射下达到88-90％的凝胶分数。 （C）1995 John Wiley and Sons，Inc. [参考：10]
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