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Electrochemical behaviour of iron and copper in a culture solution for Spirulina platensis

机译:铁和铜在螺旋藻培养液中的电化学行为

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Cyclic voltammograms of iron and copper electrodes were run in sodium hydroxide, carbonate-bicarbonate buffer and culture media for Spirulina platensis at 30 ℃. Potentiostatic steady state polarisation curves for both electrode surfaces in these electrolytes were performed in the presence and the absence of S. platensis at fixed temperature. Corrosion potential and corrosion current density values of iron and copper were obtained graphically from these curves. In all cases, the largest corrosion current density corresponded to the maximum biogenerated-oxygen concentrations, that is, illuminated culture media containing S. platensis, Corrosion potentials of iron electrodes shifted to positive values for increasing corrosion rates, whereas constant corrosion potentials were obtained for copper electrodes independently of the electrolyte.
机译:铁和铜电极的循环伏安图在30℃下在氢氧化钠,碳酸盐-碳酸氢盐缓冲液和螺旋藻培养基中进行。在固定温度下存在和不存在S. platensis的情况下,对这些电解质中两个电极表面的恒电位稳态极化曲线进行了测试。从这些曲线以图形方式获得铁和铜的腐蚀电位和腐蚀电流密度值。在所有情况下,最大的腐蚀电流密度对应于最大的生物生成氧浓度,也就是说,在含有链球菌的光照培养基中,铁电极的腐蚀电位会移至正值以提高腐蚀速率,而对于铜电极与电解液无关。

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