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首页> 外文期刊>Journal de Physique, IV: Proceedings of International Conference >Development of composition-insensitive SMA thin films with high recovery strength and large recovery strain
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Development of composition-insensitive SMA thin films with high recovery strength and large recovery strain

机译:具有高回复强度和大回复应变的对成分不敏感的SMA薄膜的开发

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摘要

After reviewing the microstructures formed in Ti-rich Ti-Ni based thin films and the associated shape memory properties, it is shown that thin films of composition-insensitive shape memory alloys (SMA) can be developed by utilizing the formation of coherent bct thin plate precipitates. Ti-rich sputter-deposited thin films of TiNi-Cu alloys are presented as such an example, which exhibit excellent shape memory properties of 500 MPa recovery stress with about 5% recovery strain for the Ti-composition range of 51-54 at. %. Necessary conditions for producing such thin films are (1) Ti-rich content, i.e., over 50 at. % (2) the amorphous initial state, (3) heat treatment at low temperatures near the crystallization temperature and (4) ternary alloy system. It is suggested that the same approach will be possible for the other ternary alloys such as Ti-Ni-Pd, Ti-Ni-Hf, etc.
机译:在审查了富钛Ti-Ni基薄膜中形成的微结构及其相关的形状记忆性能后,表明可以通过利用相干bct薄板的形成来开发对成分不敏感的形状记忆合金(SMA)的薄膜。沉淀。作为这样的示例,提出了富Ti的TiNi-Cu合金溅射沉积薄膜,该薄膜表现出出色的形状记忆特性,恢复应力为500 MPa,且Ti组成范围为51-54 at时恢复应变约为5%。 %。生产这种薄膜的必要条件是(1)富钛含量,即超过50at。%。 %(2)为非晶态初始状态,(3)在接近结晶温度的低温下进行热处理,以及(4)三元合金体系。建议对其他三元合金(例如Ti-Ni-Pd,Ti-Ni-Hf等)使用相同的方法。

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