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Effect of T-stress on the cleavage crack growth resistance resulting from plastic flow

机译:T应力对塑性流动引起的劈裂裂纹扩展阻力的影响

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Crack growth is studied numerically for cases where fracture occurs by atomic separation, so that the length scale of the fracture process is typically much smaller than the dislocation spacing. Thus, the crack growth mechanism is brittle, but due to plastic flow at some distance from the crack tip, the materials show crack growth resistance. It is shown here that the resistance is strongly dependent on the value of the non-singular T-stress, acting parallel to the crack plane. The numerical technique employed makes use of a thin dislocation-free strip of elastic material inside which the crack propagates, with the material outside described by continuum plasticity. Thus the width of the strip is a material length scale comparable to the dislocation spacing or the dislocation cell size.
机译:对于通过原子分离发生断裂的情况,对裂纹扩展进行了数值研究,因此断裂过程的长度尺度通常比位错间距小得多。因此,裂纹扩展机制是脆性的,但是由于在距裂纹尖端一定距离处的塑性流动,材料显示出抗裂纹扩展性。在此表明,电阻在很大程度上取决于平行于裂纹平面的非奇异T应力的值。所采用的数值技术利用了一条薄薄的,无错位的弹性材料带,裂纹在内部传播,而外部的材料则具有连续可塑性。因此,条带的宽度是与位错间隔或位错单元尺寸相当的材料长度尺度。

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