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首页> 外文期刊>Journal de Physique, IV: Proceedings of International Conference >Photoacoustic elastic bending method in microelectronics - invited paper
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Photoacoustic elastic bending method in microelectronics - invited paper

机译:微电子学中的光声弹性弯曲方法-邀请论文

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摘要

The basic concept, development and application of the photoacoustic elastic bending method are given. The photoacoustic effect as a function of modulation frequency including the elastic bending contribution to the photoacoustic signal is investigated. The theoretical model for a typical detection configuration was given and the relations for elastic bending and photoacoustic signal were derived by the dynamic theory of the thin plate. The applications of the PA elastic bending method in investigation of thermal and electronic transport processes in semiconductors, plasmaelastic and thermoelastic effects, metal-semiconductor structures and ion-modified layers were presented.
机译:给出了光声弹性弯曲法的基本概念,发展和应用。研究了光声效应与调制频率的函数关系,包括调制弯曲对光声信号的贡献。给出了典型检测结构的理论模型,并通过薄板动力学理论推导了弹性弯曲与光声信号的关系。介绍了PA弹性弯曲法在研究半导体热和电子输运过程,等离子体弹性和热弹性效应,金属半导体结构和离子改性层中的应用。

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