...
首页> 外文期刊>Japan Metal Bulletin >Mitsui Mining And Smelting increases a research and development of thick electrolytic copper foil
【24h】

Mitsui Mining And Smelting increases a research and development of thick electrolytic copper foil

机译:三井矿业冶炼加大对厚电解铜箔的研究开发

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

Mitsui Mining And Smelting Company announced on 18th it would strengthen research and development of thick electrolytic copper foil in the United States. The firm will use a stopping equipment of multipurpose foil investing around 900,000 dollars, and test a plant and carry out mass production trial at Oak-Mitsui Technologies LLC, OMT, which is a research and development base. The firm plans to improve the stopping equipment for multipurpose foil in Ageo factory and start to operate in fiscal 2005, and increase a production system for a high value-added special foil.
机译:三井矿业冶炼公司18日宣布,将加强美国厚电解铜箔的研发。该公司将使用投资约900,000美元的多功能箔片制动设备,并在作为研发基地的OMT-Mitsui Technologies LLC,OMT测试工厂并进行批量生产试验。该公司计划在上尾工厂改进多功能箔纸的制动设备,并于2005财年开始运营,并增加高附加值特种箔纸的生产系统。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号