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首页> 外文期刊>Diamond and Related Materials >Space charge limited conduction and electron paramagnetic resonance studies of as grown and nitrogen incorporated tetrahedral amorphous carbon films deposited by pulsed unfiltered cathodic vacuum arc process
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Space charge limited conduction and electron paramagnetic resonance studies of as grown and nitrogen incorporated tetrahedral amorphous carbon films deposited by pulsed unfiltered cathodic vacuum arc process

机译:脉冲未过滤阴极真空电弧工艺沉积并掺入氮的四面体非晶碳膜的空间电荷限制传导和电子顺磁共振研究

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摘要

This paper reports the space charge limited conduction (SCLC) and electron paramagnetic resonance (EPR) studies of as grown and nitrogen incorporated tetrahedral amorphous carbon (ta-C) films deposited by pulsed unfiltered cathodic vacuum arc process. The effect of varying substrate bias and nitrogen content on the properties of as grown and nitrogen incorporated ta-C films have been studied. The values of density of states (N(E_F)) evaluated from SCLC measurements and spin density (N_s) evaluated from EPR studies of as grown ta-C films deposited at 5 V substrate bias are found to be 1.6 X 10~(-3) cm~(-3) eV~(-1) and 6.7 X 10~(19) cm~(-3), respectively, which decrease to 8.7 X 10~(18) cm~(-3) eV~(-1) and 4.6 X 10~(19) cm~(-3), respectively, with the increase of substrate bias up to 80 V and beyond 80 V substrate bias these values are found to increase. A small amount of nitrogen incorporation up to 3.6 at. percent nitrogen content in nitrogen incorporated ta-C films reduces the values of N(E.) and N, to 1.4 X 10~(19) cm~(-3) eV~(-1) and 4.3 X 10~(19) cm~(-3), respectively. Beyond 3.6 at. percent nitrogen content, the values of N(E_F) and N, are found to increase monotonically to 2.6 X 10~(19) cm~(-3) eV~(-1) and 1.0 X 10~(20) cm~(-3), respectively. in nitrogen incorporated ta-C films with further increase of nitrogen content up to 15.6 at. percent. The local minimum in the values of N(E_F) and N, in as grown ta-C films deposited at 80 V substrate bias arises due to the ability of sp~2 sites to pair up. Nitrogen incorporation up to 3.6 at. percent in nitrogen incorporated ta-C films seems to compensate the p-type nature and beyond 3.6 at. percent nitrogen content the donor electron increases the values of N(E_F) and N, in the films.
机译:本文报道了通过脉冲未过滤阴极真空电弧工艺沉积和掺入氮的四面体非晶碳(ta-C)薄膜的空间电荷受限传导(SCLC)和电子顺磁共振(EPR)研究。已经研究了改变衬底偏压和氮含量对生长的和掺氮的ta-C膜的性能的影响。通过SCLC测量评估的状态密度(N(E_F))和通过EPR研究评估的在5 V衬底偏压下生长的ta-C薄膜的自旋密度(N_s)的值为1.6 X 10〜(-3 )cm〜(-3)eV〜(-1)和6.7 X 10〜(19)cm〜(-3),减小到8.7 X 10〜(18)cm〜(-3)eV〜(- 1)和4.6 X 10〜(19)cm〜(-3),随着衬底偏置电压的增加,直到80 V,超过80 V衬底偏置电压,这些值都增加了。少量氮掺入量高达3.6 at。掺氮的ta-C膜中的氮含量百分比将N(E。)和N的值降低到1.4 X 10〜(19)cm〜(-3)eV〜(-1)和4.3 X 10〜(19) cm〜(-3)。超过3.6 at。氮含量百分比(N(E_F)和N的值)单调增加到2.6 X 10〜(19)cm〜(-3)eV〜(-1)和1.0 X 10〜(20)cm〜( -3)。在掺氮的ta-C膜中,氮含量进一步增加到15.6 at.。百分。 N(E_F)和N值的局部最小值是由于sp〜2位点配对的能力而导致的,该生长的ta-C膜在80 V衬底偏压下生长。氮掺入量达3.6 at。掺氮的ta-C膜中的5%似乎补偿了p型性质,超过了3.6 at。%。氮含量的百分比供体电子增加了薄膜中N(E_F)和N的值。

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