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Localized DLC etching by a non-thermal atmospheric-pressure helium plasma jet in ambient air

机译:非热大气压氦等离子体射流在环境空气中进行局部DLC蚀刻

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摘要

Using a versatile atmospheric-pressure helium plasma jet, diamond-like carbon (DLC) films were etched in ambient air. We observed that the DLC films are etched at a nominal rate of around 60 nm/min in the treated area (230 mu m in diameter) during a 20-min exposure. The etching rate increased after the initial 10-min exposure. During this period, the flat DLC surface was structurally modified to produce carbon nanostructures with a density of similar to 2.4 x 10(11) cm(-2). With this increase in surface area, the etching rate increased. After 20 min, the DLC film had a circular pattern etched into it down to the substrate where silicon nanostructures were observed with sizes varying from 10 nm to 1 mu m. The initial carbon nanostructure formation is believed to involve selective removal of the sp(2)-bonded carbon domains. The carbon etching results from the formation of reactive oxygen species in the plasma. (C) 2014 Elsevier B.V. All rights reserved.
机译:使用通用的大气压氦等离子体射流,在环境空气中蚀刻出类金刚石碳(DLC)膜。我们观察到,在20分钟的曝光时间内,DLC膜以约60 nm / min的标称速率在处理区域(直径230微米)中被蚀刻。最初的10分钟曝光后,蚀刻速率增加。在此期间,平坦的DLC表面在结构上进行了修饰,以产生密度接近2.4 x 10(11)cm(-2)的碳纳米结构。随着表面积的增加,蚀刻速率增加。 20分钟后,DLC膜具有蚀刻到其内的圆形图案直到衬底,在该衬底上观察到硅纳米结构,尺寸为10nm至1μm。最初的碳纳米结构形成被认为涉及sp(2)键碳域的选择性去除。碳蚀刻是由等离子体中反应性氧的形成引起的。 (C)2014 Elsevier B.V.保留所有权利。

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