Molecular Dynamics Simulation of Dimple Formation Process on Ductile Fracture Surface

摘要

On the basis of the drawbacks of the existing theoretical and/or simulation methods, a new coupled analytical/MD method has been proposed to study void and dimple formation in the ductile fracture of a defect-free monocrystal copper. The result of the simulation shows that void and dimple formation in a defect-free monocrystal copper occurs, first, through a phase change from a monocrystal structure to a polycrystal structure, and then by a force system that produces relative rotations of grains.