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The reduction of copper(II) and the oxidation of thiosulfate and oxysulfur anions in gold leaching solutions

机译:金浸出溶液中铜(II)的还原以及硫代硫酸根和氧硫离子的氧化

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摘要

Due to the increasing environmental and public concerns associated with cyanide leaching of gold, much of the current research in gold hydrometallurgy is focused on alternative systems, such as thiosulfate. One of the major problems with the thiosulfate leaching system is the undesirable reaction between thiosulfate and copper(II). The current paper presents a study on the effect of various anions on the rate of this reaction. It will be shown that the presence of anions such as sulfate, chloride and phosphate significantly reduce the rate at which copper(II) is reduced by thiosulfate. The presence of other oxysulfur species such as sulfite, tetrathionate and trithionate were also studied. These species were found to be readily oxidised by copper (II) and hence greatly increased the rate of copper(II) reduction. The rate of copper(II) reduction by tetrathionate is relatively unaffected by the addition of anions; however, anion addition was found to significantly influence the rate of copper(II) reduction by sulfite and trithionate. Based on these results, inner sphere mechanisms were proposed for the reaction of copper(II) with thiosulfate, sulfite and trithionate. The kinetics of copper(II) reduction is thus very complex and can be represented by a number of parallel-series reaction sequences.
机译:由于与氰化物浸出金相关的环境和公众日益关注的问题,目前在金湿法冶金中的许多研究都集中在替代系统上,例如硫代硫酸盐。硫代硫酸盐浸出系统的主要问题之一是硫代硫酸盐和铜(II)之间的不良反应。目前的论文提出了对各种阴离子对该反应速率的影响的研究。将显示阴离子如硫酸根,氯离子和磷酸根的存在显着降低了硫代硫酸盐还原铜(II)的速率。还研究了其他氧硫物质的存在,例如亚硫酸盐,四硫酸盐和三硫酸盐。发现这些物质易于被铜(II)氧化,因此大大提高了铜(II)的还原速率。四硫氰酸盐还原铜(II)的速率相对不受阴离子添加的影响。然而,发现添加阴离子显着影响亚硫酸盐和三硫代硫酸盐还原铜(II)的速率。基于这些结果,提出了内球机理用于铜(II)与硫代硫酸盐,亚硫酸盐和三硫代硫酸盐的反应。因此,铜(II)还原的动力学非常复杂,可以用许多平行串联反应序列表示。

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